SPTS VPX PECVD SYSTEM consisting of:
     
  
-  STS VpX PECVD 
- 1 x PECVD source
- Process:  SiO2 and SiN deposition. 
- Gas configuration: SiH4, N2, N20, O2, C4F8
- Mixed Frequency configuration:
        a) ENI ACG6B RF Power Supply, 600W ,13.56MHZ
        b) Adtec 13.56MHz 2500W rated matching network
        c) RFPP LF10, 1000W 380khz Coaxial Power LF Power Supply
        d) Adtec 380KHz 2500W rated matching network
- Brooks MX400 Cluster Core
- 1 x Vacuum Cassette Station 
- Setup for 8"/200mm wafers 
- Cassette to cassette auto-loading system
- Offers the most advanced technology for PECVD
- Windows Software control PC 
- PLC Based Control System
- Touch-Screen Operator Interface
- Single Vacuumm Cassette Load-Lock & Cluster Core
- Central 4-port cluster core with Brooks Robot
- 1 x Brooks VCE5 Vacuum Cassette Handler
- Brooks Robot Arm Adapter for 1x200mm substrates
- Neslab HX150 Chiller (or equivalent) 
- Edwards QDP80 with Blower (chamber pump)
- Edwards QDP40 (load lock pump)  
- Year of Manufacture: 2008
- S/N: CPO133
- Operations Manual and Documentation

FULLY REFURBISHED SYSTEM MEETING ORIGINAL SPECIFICATIONS:

- Chamber disassembled for refurbishment.
- Chamber received full wet clean.
- Chamber o-rings and seals are replaced with brand new.
- Electrostatic Chuck (ESC) sent out for refurbishment (if applicable)
- All MFCs rebuilt and calibrated professionally.
- All corrosive gas lines replaced with brand new.
- All Non-corrosive gas lines purged.
- Vacuum pumps professionally rebuilt.
- Turbo pump professionally rebuilt.
- Chillers serviced and fully tested.
- All wiring/wire harnesses are checked, repaired or replaced if needed.
- All liquid and air lines, tubing and fittings checked and replaced if necessary.
- Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed.
- Checkout of all electronic and mechanical parts.
- Machine covers are cleaned, polished or replaced as needed.
- Post-refurbishment system leak and RF calibration checks, with documentation provided to customer.
- System cycle and repeatability testing completed prior to cover replacement and wipe down.
- A software license may be obtained directly from SPTS
- SPTS does not certify any third party equipment refurbishments
- System components carefully packed, labeled, and professionally crated.

SPTS MULTIPLEX ICP SR ETCHER consisting of: 


- Model: MESC ICP
- Process SiC, III-V, or Metal Etch
- Single process chamber with manually loaded vacuum loadlock 
- Inductively Coupled Plasma Source (ICP)
- Currently Configured for 8"/200mm Wafers
- Carousel Load Lock (Single-Wafer Carousel or multiple wafers on carrier)
- Heated Lower Chamber 
- Load-Lock Chamber 
- Helium Substrate Backside Cooling
- 200mm Weighted Clamp
- Ebara AA10N Vacuum Pump (Chamber)
- Ebara AAL10 Vacuum Pump (Load Lock)
- Affinity Chiller 
- E-Rack 
- 13.56MHz RF Generator (Source)
- 13.56MHz RF Generator (Lower Electrode)
- Leybold MAG 900 CT Turbo Pump 
- System Cables (full set)
- User Manuals & Documentation 
- Year of Manufacture: 2004
- Serial Number: 50543


On Board Gas Box with Following Gas Configuration:
    - O2 @ 50 SCCM
    - SF6 @ 100
    - Ar @ 50 SCCM
    - He @ 50 SCCM
    - CF4 @ 100 SCCM
    - CHF3 @ 100 SCCM
    - NF3 @ 100 SCCM

FULLY REFURBISHED SYSTEM MEETING ORIGINAL SPECIFICATIONS:

- Chamber disassembled for refurbishment.
- Chamber received full wet clean.
- Chamber o-rings and seals are replaced with brand new.
- Electrostatic Chuck (ESC) sent out for refurbishment (if applicable)
- All MFCs rebuilt and calibrated professionally.
- All corrosive gas lines replaced with brand new.
- All Non-corrosive gas lines purged.
- Vacuum pumps professionally rebuilt.
- Turbo pump professionally rebuilt.
- Chillers serviced and fully tested.
- All wiring/wire harnesses are checked, repaired or replaced if needed.
- All liquid and air lines, tubing and fittings checked and replaced if necessary.
- Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed.
- Checkout of all electronic and mechanical parts.
- Machine covers are cleaned, polished or replaced as needed.
- Post-refurbishment system leak and RF calibration checks, with documentation provided to customer.
- System cycle and repeatability testing completed prior to cover replacement and wipe down.
- A software license may be obtained directly from SPTS
- SPTS does not certify any third party equipment refurbishments
- System components carefully packed, labeled, and professionally crated.

SPTS MULTIPLEX ASE-HRM ICP PRO ETCHER consisting of:

Configuration: 
- Model: Multiplex ICP PRO 
- Process Chamber: ASE-HRM 
- ASE-HRM chamber: High Rate Magnetic source achieves over three times the etch rates versus the original Bosch process
- Process: deep silicon etch
- Operating sofware: Windows 2000 Professional
- Currently set to process: 150mm 
- Max wafer size capable: 200mm 
- Year of Manufacture: 2004


Vacuum Load-lock For Single Chamber Multiplex systems (MESC):
- MACS loader (cassette to cassette loader)
- Carousel Load Lock (150mm)
- Chamber lid temperature control
- Fully automatic transfer of substrates between the load-lock and the process chamber
- Loader may be configured for substrates up to 200mm in diameter (currently set for 150mm)

Multiplex ICP Process Chamber:
- Production proven single wafer process chamber (aluminium) 
- Balun Coil for High Rate Etch
- Leybold MAG 2000 CT Turbo Pump
- VAT Pendulum Valve
- Backside Helium Cooling 
- Electro-Static Chuck (ESC)
- Remote sealed extracted gas box with orbitally welded gas lines 
- Electronics cabinet  
- LCD flat panel monitor 
- Fully automatic multistep processing or manual operation
- ENI ACG-6B RF High Frequency 
- Advanced Energy LF-5 Low Frequency 
- Spectrum B-3013 3kW 13.56 MHz 
- Edwards iH80 Vacuum Pump (Load Lock)
- Edwards iH600 Vacuum Pump (Chamber)
- 2 Affinity Chillers
- System Cables (full set)
- System Power: 208V, 60Hz, 3PH
- CE Certified

- Gas Box with gas configuration as follows:
- Ar2 - 100 sccm
- O2 - 100 sccm
- C4F8 - 300 sccm
- SF6 - 600 sccm
- N2 - vent 


- Operations Manuals, Electrical Drawings and Documentation (Complete Manual Set)
- Refurbished to excellent condition by SPTS factory trained technicians.

SPTS MPX ICP ETCHER consisting of:

- Model: MPX PRO ICP
- Previously used for SiC (Silicon Carbide) Etch Process
- Single process chamber with manually loaded vacuum loadlock, with carousel wafer handler 2 wafers
- Inductively Coupled Plasma Source (ICP)
- Currently Configured for 4"/100mm Wafers
- Capable of processing up to 8"/200mm wafers
- Carousel Load Lock (2-Wafer Carousel)
- Heated Lower Chamber
- Load-Lock Chamber
- Helium Substrate Backside Cooling
- Weighted Clamp
- Edwards IH80 Vacuum Pump (Chamber)
- Alcatel Adixen ACG 28G Vacuum Pump (Load Lock)
- SMC Thermo Chiller
- Electronics Rack
- MKS Spectrum 1.5KW 13.56MHz RF Generator (Source)
- ENI ACG3B 13.56MHz RF Generator (Lower Electrode)
- Leybold MAG 1500 CT Turbo Pump
- System Cables (full set)
- SPTS PRO System Software
- Verity Instruments SD1024F Smart Spectrograph EPD
- User Manuals & Documentation
- All Passwords Needed to Operate the System
- Year of Manufacture: 2011
- Serial Number: MPO691


On Board Gas Box with following Gas Configuration:
- O2 @ 100 SCCM
- C4F8 @ 200 SCCM
- SF6 @ 200
- Ar @ 200 SCCM
- He @ 200 SCCM
- CF4 @ 200 SCCM
- CHF3 @ 100 SCCM
- NF3 @ 200 SCCM

FULLY REFURBISHED:

- Chamber disassembled for refurbishment.
- Chamber received full wet clean.
- Chamber o-rings and seals are replaced with brand new.
- Electrostatic Chuck (ESC) sent out for refurbishment (if applicable)
- All MFCs rebuilt and calibrated professionally.
- All corrosive gas lines replaced with brand new.
- All Non-corrosive gas lines purged.
- Vacuum pumps professionally rebuilt.
- Turbo pump professionally rebuilt.
- Chillers serviced and fully tested.
- All wiring/wire harnesses are checked, repaired or replaced if needed.
- All liquid and air lines, tubing and fittings checked and replaced if necessary.
- Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed.
- Checkout of all electronic and mechanical parts.
- Machine covers are cleaned, polished or replaced as needed.
- Post-refurbishment system leak and RF calibration checks, with documentation provided to customer.
- System cycle and repeatability testing completed prior to cover replacement and wipe down.
- A software license may be obtained directly from SPTS
- SPTS does not certify any third party equipment refurbishments
- System components carefully packed, labeled, and professionally crated.

PICOSUN SUNALE P 300 ATOMIC LAYER DEPOSITION (ALD) SYSTEM consisting of:

- Model: Sunale P 300
- Configured for 150mm Wafers
- Up to 200mm Wafers
- Touch Panel PC
- Vacuum Chamber: AISI 304 Stainless Steel Vessel with 10 NW40KF Connection Flanges with Viton Seals
- Reaction Chamber: RC-200 PicoBatch Chamber, Large Sized (316SS) with Metal Sealing Surface
- Alarm Systems: Picozone O3 Alarm Systems
- Substrate Loader: Pneumatic Chamber Lift Mechanism Operational from Touch Panel
- Wafer Handling: Faith Rapitran II Automatic Wafer Handling System
- Vacuum Line Accessories: Afterburner and Powder Trap
- Picozone O3 Delivery System
- Picogases Connection Source System for High Vapor Pressure Gaseous Precursors in a Ventilated Cabinet
- Large Picosolution Cooled Source Systems for 600 ml of high Vapor Pressure Liquid Precursors (for TMA & DI Water) in a Ventilated Cabinet
- Software: Multisource Software with Customization

SPTS PRIMAXX MONARCH 3 HF RELEASE ETCH consisting of:

- Vapour HF Oxide Etcher
- For Anhydrous HF Gas Etching of Oxide
- Currently Configured for 6”/150mm Wafers
- Capable of processing up to 8”/200mm Wafers
- Semi-Automatic 3-Wafer Loader with Load Lock
- Single Process Chamber
- Integrated Panel PC with on-board electronics minimizes cleanroom footprint
- Third generation process chamber has been designed for easy wafer size
changed and maintenance
- Vacuum Pumps (as required)
- User Manuals & Documentation
- Vintage: 2010

PLASMATHERM 790 RIE ETCHER consisting of:

- Model: 790 RIE
- RIE Chamber
- Capable of Processing up to 8"/200mm Wafers
- Manual Wafer Load Chamber (Non-Load Lock)
- RFPP RF5S 500W, 13.56MHz Generator
- Leybold Turbotronik NT 150/360 Controller
-Turbo pump LH Turbovac 151
- MKS 626B, 1 Torr Baratron Pressure Gauge
- Ion Gauge
- MKS 919 Ion Gauge Controller
- System Computer, Keyboard and Mouse
- Four Channel Gas Box (may be upgraded up to 8 channel.)
- Brand New LCD Monitor
- Plasmathem Controller
- Neslab Chiller
- System Vacuum Pump
- EMO Button
- System Power: 208V, 60Hz
- Operations Manual
- Refurbished to Excellent Condition
- Available for Full Inspection and Demonstration at ClassOne!

ClassOne Support Worldwide of Plasmatherm RIE Etchers:

- ClassOne Supports all our Used and Refurbished Plasmatherms with Spare Parts and Service Worldwide
- Installation & Training available Worldwide
- Our Refurbishment Process: http://www.classoneequipment.com/content/etching-systems

OXFORD PLASMALAB 80 PLUS RIE ETCHER consisting of:

- Model: Plasmalab 80 Plus RIE / PE
- Single Chamber RIE, non-load locked
- Ideal for R&D reactive ion etch applications
- Configured for: 150mm wafers
- Platen: 200mm diameter
- Oxford PC2000 Software
- 300W Advanced Energy Hilight 133 RF Generator
- Edwards QDP80 Vacuum Pump & 250 Blower (professionally rebuilt)
- System Chiller (professionally rebuilt)
- System Dimensions: 23"x40"x59" (LxWxH)
- Operations Manual and Documentation
- Fully Refurbished to like-new condition (see below details)

GAS CONFIGURATION (Can be upgraded up to 6 Gases):
- O2
- He2

REFURBISHED TO EXCELLENT CONDITION consisting of:

- Chamber disassembled for refurbishment.
- Chamber received full wet clean.
- Chamber o-rings and seals are replaced with brand new.
- All MFCs rebuilt and calibrated professionally.
- All corrosive gas lines replaced with brand new.
- All Non-corrosive gas lines cleaned.
- Vacuum pumps professionally rebuilt.
- Turbo pump professionally rebuilt.
- Chillers serviced and fully tested.
- All wiring/wire harnesses are checked, repaired or replaced if needed.
- All liquid and air lines, tubing and fittings checked and replaced if necessary.
- Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed.
- Checkout of all electronic and mechanical parts.
- Machine covers are cleaned, polished or replaced as needed.
- Equipment is fully tested to verify compliance to specifications.
- Post-refurbishment system leak and RF calibration checks, with documentation provided to customer.
- System cycle and repeatability testing completed prior to cover replacement and wipe down.

OXFORD PLASMALAB 80 PLUS PECVD consisting of:

- Model: Plasmalab 80 Plus
- Single PECVD chamber, non load-locked
- PC
- PC2000 Software
- ENI ACG-3 RF Generator
- Honeywell Temperature Controller
- MKS 152 Automatic Pressure Controller
- Vacuum Pump with Blower
- Chiller
- Operations Manual and Documentation

Gas Pod Currently Configured for:
- CH4: 500sccm
- He: 1000sccm
- SiH4: 50sccm
- NH3: 50sccm
- N2: 1000sccm
- Clean Gas (Manual Flow Meter)

OXFORD PLASMALAB 100 PECVD consisting of:
  
- Model: Plasmalab 100 PECVD
- Process: SiO2 and SiN deposition
- Max Wafer Size Capable: 8"/200mm
- Single wafer process up to 8-inch wafer
- Load Locked Chamber
- 600W RF Generator
- Substrate Electrode: 205mm
- Shower Head Gas Inlet Optimised for PECVD
- 400° C Substrate Table
- System Computer
- System Chiller 
- Alcatel 2033 Vacuum Pump (Loadlock Pump) 
- Alcatel 2033 Vacuum Pump & RSV301B Blower (Chamber Pump)
- Oxford PC2000 Software
- Windows XP Operating Software (OS)
- Operations Manuals for Plasmalab 100 PECVD  
- Manufactured in 2008!
- Serial number: 94-814892 
- CE Certified
 
- Gas cabinet setup with 7 gases as follows: 
1. CF4/O2                 500sccm       MKS 1179  viton seals
2. N2                         2SLM            MKS 1179  viton seals
3. N2O                      1SLM             MKS 1179  viton seals
4. HE                        2SLM             MKS 1179  viton seals
5. SiH4                     50sccm          MKS 1479  metal seals
6. PH3/AR                50sccm          MKS 1479  metal seals
7. B2H6/AR              50sccm          MKS  1479 metal seals

OXFORD PLASMALAB 100 ICP ETCHER consisting of:

- Model: Plasmalab 100 ICP
- Inductive Coupled Plasma Source (ICP380)
- Chuck size: 8"/200mm diameter (8" platen)
- Chuck type: Mechanical Wafer Clamping
- Load-locked single chamber (ICP)
- Alcatel ATH1300M Maglev Turbo Pump
- Alcatel ACT 1300M Controller
- HP Compaq Computer
- LCD Monitor, Keyboard, and Mouse
- Load Lock Vacuum Pump
- Chamber Vacuum Pump
- Chiller
- AE HFV8000 RF Generator
- Seren R601 RF Generator
- LN2 Electrode Cooling Lines
- EMO Button
- Operations Manual for Oxford 100 ICP Etcher
- Offered as Fully Refurbished and Meeting Specifications.

GAS POD CONFIGURED WITH UP TO 6 MFCS currently consisting of:
1) MKS Model: 1179, Range: 50 SCCM, Gas: 02
2) MKS Model: 1179, Range: 100 SCCM, Gas: AR
3) MKS Model: 1179, Range: 100 SCCM, Gas: CHF3
4) Brooks Model: 1479, Range: 200 SCCM, Gas: CL2
5) Brooks Model: 1179, Range: 30 SCCM, Gas: BCL3
6) Brooks Model: 1179, Range: 200 SCCM, Gas: C4F8

CLASSONE REFURBISHMENT PROCESS FOR OXFORD RIE AND ICP ETCHERS consisting of:

- Chamber disassembled for refurbishment.
- Chamber received full wet clean.
- Chamber o-rings and seals are replaced with brand new.
- Electrostatic Chuck (ESC) sent out for refurbishment (if applicable)
- All MFCs rebuilt and calibrated professionally.
- All corrosive gas lines replaced with brand new.
- All Non-corrosive gas lines cleaned.
- Vacuum pumps professionally rebuilt.
- Turbo pump professionally rebuilt.
- Chillers serviced and fully tested.
- All wiring/wire harnesses are checked, repaired or replaced if needed.
- All liquid and air lines, tubing and fittings checked and replaced if necessary.
- Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed.
- Checkout of all electronic and mechanical parts.
- Machine covers are cleaned, polished or replaced as needed.
- Equipment is fully tested to verify compliance to specifications.
- Post-refurbishment system leak and RF calibration checks, with documentation provided to customer.
- System cycle and repeatability testing completed prior to cover replacement and wipe down.
- System components carefully packed, labeled, and professionally crated.

OXFORD PLASMALAB 100 ICP ETCHER consisting of:

- Model: Plasmalab 100 ICP
- Inductive Coupled Plasma Source (180 ICP)
- Max Capable: 6"/150mm diameter
- Current set up to run 4"/100mm Wafers
- Chuck type: Mechanical Clamping
- Load-locked single chamber (ICP)
- Advanced Energy RFX600 13.56 Mhz RF Generator
- Advanced Energy RFX3000 13.56 Mhz RF Generator
- Alcatel ATH1300M Maglev Turbo Pump
- Alcatel ACT 1300M Controller
- HP Compaq Computer w/ Win NT 4.0
- PC2000NT Software Ver. 2.57.92
- LCD Monitor, Keyboard, and Mouse
- 2 Leybold Vacuum Pumps
- EMO Button
- Operations Manual
- Offered as Fully Refurbished!
- Manufactured in: 2002

GAS POD CONFIGURED WITH 6 MFCS consisting of:
- CHF3
- SF6
- O2
- Ar
- C4F8
- BCL3

CLASSONE REFURBISHMENT PROCESS FOR OXFORD RIE & ICP ETCHERS consisting of:

- Chamber disassembled for refurbishment.
- Chamber received full wet clean.
- Chamber o-rings and seals are replaced with brand new.
- Electrostatic Chuck (ESC) sent out for refurbishment (if applicable)
- All MFCs rebuilt and calibrated professionally.
- All corrosive gas lines replaced with brand new.
- All Non-corrosive gas lines cleaned.
- Vacuum pumps professionally rebuilt.
- Turbo pump professionally rebuilt.
- Chillers serviced and fully tested.
- All wiring/wire harnesses are checked, repaired or replaced if needed.
- All liquid and air lines, tubing and fittings checked and replaced if necessary.
- Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed.
- Checkout of all electronic and mechanical parts.
- Machine covers are cleaned, polished or replaced as needed.
- Equipment is fully tested to verify compliance to specifications.
- Post-refurbishment system leak and RF calibration checks, with documentation provided to customer.
- System cycle and repeatability testing completed prior to cover replacement and wipe down.
- System components carefully packed, labeled, and professionally crated.

LAM 9600 ETCHING SYSTEM consisting of:

- Model: TCP9600SE
- Currently Configured for 6"/150mm Wafers
- Wafer Path: Flat Aligner > Load Lock > Etch Chamber > Load Lock / DSQ (strip) > APM Wafer Rinse > Wafer Cassette Out
- TCP Etch Source for Metal Etching
- DSQ Module for Stripping
- Electro-Static Chuck w/ He Cooling
- 3 RF Power Supplies
- Battery for Safe Turbo Shutdown on Main Power Loss
- Edwards STPH1000C Turbo Pump
- Classic Software Version
- 703nm (Alu) & 520nm Optical End Point Detection
- Gases: BCL3, Cl2, N2, Ar, O2 (strip), H2O (strip)
- S/N 4275

APPLIED MATERIALS P5000 PECVD OXIDE DEPOSITION & RIE OXIDE ETCH SYSTEM consisting of:

- Model: P5000
- Currently Configured for 6"/150mm Wafers
- 2 Chambers: PECVD Oxide Deposition & RIE Oxide Etch

Tepla 300 Plasma Asher consisting of:

- Model: 300 AL PC Main System
- Manual wafer load plasma asher
- Designed for Wafer Cleaning and Descum
- Plasma Chamber: Quartz

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- Model: MESC ICP / DRIE
- Process: Deep Silicon Etch (DRIE)
- Single process chamber with manually loaded vacuum loadlock
- Inductively Coupled Plasma Source (ICP)
- Currently Configured for 8"/200mm Wafers
- Carousel Load Lock (2-Wafer Carousel)
- Load-Lock Chamber
- Electrostatic Chuck (ESC)
- Edwards IQDP80 Vacuum Pump (Chamber)
- Edwards 40 Vacuum Pump (Load Lock)
- Affinity Chiller
- E-Rack
- 13.56MHz RF Generator (Source)
- 13.56MHz RF Generator (Lower Electrode)
- Leybold Turbo Pump
- System Cables (full set)
- User Manuals & Documentation
- Serial Number: 28143

On Board Gas Box with Following Gas Configuration:

- Ar
- SF6
- C4F8
- O2
- N2

- Chamber disassembled for refurbishment.
- Chamber received full wet clean.
- Chamber o-rings and seals are replaced with brand new.
- Electrostatic Chuck (ESC) sent out for refurbishment (if applicable)
- All MFCs rebuilt and calibrated professionally.
- All corrosive gas lines replaced with brand new.
- All Non-corrosive gas lines purged.
- Vacuum pumps professionally rebuilt.
- Turbo pump professionally rebuilt.
- Chillers serviced and fully tested.
- All wiring/wire harnesses are checked, repaired or replaced if needed.
- All liquid and air lines, tubing and fittings checked and replaced if necessary.
- Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed.
- Checkout of all electronic and mechanical parts.
- Machine covers are cleaned, polished or replaced as needed.
- Post-refurbishment system leak and RF calibration checks, with documentation provided to customer.
- System cycle and repeatability testing completed prior to cover replacement and wipe down.
- System components carefully packed, labeled, and professionally crated.

PLASMATHERM SLR-720 RIE consisting of:

- Model: SLR-720
- Single chamber with load lock
- Can process up to 8"/200mm wafers
- Turbo Pump
- AEI/RFPP RF5S 500W RF Generator
- Leybold Trivac D65BCS Vacuum Pump
- Leybold Trivac D25BCS Vacuum Pump
- Neslab HX-75 Recirculating Chiller
- Power Box
- Process Software
- Set of Operation and Maintenance Manuals
- 4 MFCs:
*SF6
*N2
*CHF3
*O2


REFURBISHED TO MEET OEM SPECIFICATIONS:

- Chamber disassembled and receives full wet clean.
- All Chamber o-rings and seals are replaced with brand new.
- Electrostatic Chuck (ESC) sent out for refurbishment (if applicable)
- All MFCs rebuilt and calibrated professionally.
- All corrosive gas lines replaced with brand new.
- All Non-corrosive gas lines cleaned.
- Vacuum pumps professionally rebuilt.
- Turbo pump professionally rebuilt.
- Chillers serviced and fully tested.
- All wiring/wire harnesses are checked, repaired or replaced if needed.
- All liquid and air lines, tubing and fittings checked and replaced.
- Major components disassembled for checkout, servicing, cleaning, and lubricating. Parts are repaired or replaced as needed.
- Checkout of all electronic and mechanical parts.
- Machine covers are cleaned, polished or replaced as needed.
- Equipment is fully tested to verify compliance to OEM and customer specifications.
- Post-refurbishment system leak and RF calibration checks, with documentation provided to customer.
- System cycle and repeatability testing completed prior to cover replacement and wipe down.
- Transport locks installed; all system components carefully packed, labeled, and professionally crated.

OXFORD PLASMALAB 133 ICP 380 ETCHER consisting of:

- Model: Plasmalab 133 ICP
- Inductive Coupled Plasma Source (ICP380)
- Load-locked single chamber (ICP)
- Electrode: 380mm
- Alcatel ATH1300M Maglev Turbo Pump
- Alcatel Adixen ACT 1300M Controller
-Advanced Energy RF Power Generator
- Computer with PC2000
- LCD Monitor, Keyboard, and Mouse
- Alcatel Adixen ADP 122 P Vacuum Pump
- Alcatel CP 40G Vacuum Pump
- Chiller
- EMO Button
- Operations Manual and Documentation
- Offered as Fully Refurbished and meeting Original Specifications.

GAS POD CONFIGURED WITH 6 MFCS consisting of:
1) BCL3 @ 50 SCCM
2) CL2 @ 50 SCCM
3) CH4 @ 100 SCCM
4) O2 @ 200 SCCM
5) AR @ 100 SCCM
6) H2 @ 50 SCCM

REFURBISHED TO MEET OEM SPECIFICATIONS consisting of:

- Chamber disassembled for refurbishment
- Chamber received full wet clean
- Chamber o-rings and seals are replaced with brand new
- Electrostatic Chuck (ESC) sent out for refurbishment (if applicable)
- All MFCs rebuilt and calibrated professionally
- All corrosive gas lines replaced with brand new
- All Non-corrosive gas lines cleaned
- Vacuum pumps professionally rebuilt
- Turbo pump professionally rebuilt
- Chillers serviced and fully tested
- All wiring/wire harnesses are checked, repaired or replaced if needed
- All liquid and air lines, tubing and fittings checked and replaced if necessary
- Major components disassembled for checkout, servicing, cleaning, and lubricating - parts are repaired or replaced as needed
- Checkout of all electronic and mechanical parts
- Machine covers are cleaned, polished or replaced as needed
- Equipment is fully tested to verify compliance to specifications
- Post-refurbishment system leak and RF calibration checks, with documentation provided to customer
- System cycle and repeatability testing completed prior to cover replacement and wipe down
- System components carefully packed, labeled, and professionally crated

OXFORD PLASMALAB 100 ICP ETCHER SYSTEM consisting of:

CONFIGURATION:
- Model: Plasmalab 100 ICP
- Inductive Coupled Plasma Source (ICP180)
- Max Wafer size: 6"/150mm
- Load-locked single chamber (ICP)
- Helium Backside Cooling (HBC)
- Turbo Pump ATH-900 turbo with controller
- Computer with Windows 7

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